A Numerical-Experimental Method for Drop Impact Analysis of Composite Landing Gear

Aeroacoustic Analysis of a Simplified Landing Gear

A hybrid approach is used to investigate the noise generated by a simplified landing gear without small scale parts such as hydraulic lines and fasteners. The Ffowcs Williams and Hawkings equation is used to predict the noise at far-field observer locations from flow data provided by an unsteady computational fluid dynamics calculation. A simulation with 13 million grid points has been complete...

Development of a composite torque link for helicopter landing gear applications

Numerical and Experimental Investigation of Cold orBital Forging of a 16MnCr5 Alloy Spur Bevel Gear

The purpose of this research is to analyze the forging of bevel gears based on conventional forging method with material number 1.7131 with finite element method by means of SUPER FORGE software and to compare it with experimental cold orbital forging results.After doing simulation of conventional forging and obtaining press tonnage due to orbital forging method with DEFORM software, orbital fo...

Numerical Analysis of Composite Beams under Impact by a Rigid Particle

Analysis of a laminated composite beam under impact by a rigid particle is investigated. The importance of this project is to simulate the impact of objects on small scale aerial structures. The stresses are considered uni- axial bending with no torsion loading. The first order shear deformation theory is used to simulate the beam. After obtaining kinematic and potential energy for a laminated ...

Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact

Board-level solder joint reliability is very critical for handheld electronic products during drop impact. In this study, board-level drop test and finite element method (FEM) are adopted to investigate failure modes and failure mechanisms of lead-free solder joint under drop impact. In order to make all ball grid array (BGA) packages on the same test board subject to the uniform stress and str...